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TMExternalUse1Topics1.i.MX6HWDesignReferenceBoard.(gothroughschematicofi.MX6SDP)2.i.MX6HardwareDevelopmentGuide.(IMX6DQ6SDLHDG.pdf)3.i.MXHWC

heckingList.(Excelfileofi.MX6HWDesignCheckingList)4.i.MX6XPowerdesign5.DDRCalibrationandStressTest.6.IOMuxTool1IMX硬件设计指南与硬件启动医学知识讲解4/

19/2023TMExternalUse2i.MX6HWDesignReferenceBoard.2IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TMExternalUse3RelatedHardwarematerials•SABRESDP_DESIGNFILE

S.zip/SABRE_AI_DESIGNFILES.zip:SDP/AIboardschematic/layout.•IMX6DQ6SDLHDG.pdf:i.MX6Xhardwaredesigngu

ide,includeschematic/layoutcheckpoints,iomuxtools,bringup,IBIS/BSDL,RMIIinterface.•IMX6DQ/DLS_A/I/CEC.pdf:i.MX6XDatas

heet:includechipsetelectricalCharacteristicslikethevoltagerange,MaxcurrentandPowersequence.•IMX6DQ/DLS_RM.

pdf:i.MX6XChipsetreferencemanual.•AN4509:i.MX6DQPowerConsumptionMeasurement.•AN4576:i.MX6DLSPowerCon

sumptionMeasurement.•IMX6_IOMUX_TOOL:iomuxconfigurationtools.•Mfgtools-Rel-4.1.0_130816_MX6Q_UPDATER.tar.gz:MFGtools.•L3.0.

35_4.1.0_130816_images_MX6.tar.gz:linuxdemoimage.•HWDesignCheckingListfori.Mx6Rev2.6.xlsx:i.MX6Xhardwarechecklist,downloadfrom:http

s://community.freescale.com/docs/DOC-93819•DDR_Stress_Tester_v1.0.3.zip:DDRtesttools,downloadfrom:https://community

.freescale.com/docs/DOC-96412•i.Mx6DQSDLDDR3ScriptAid:DDRconfigurationtools,Downloadfrom:https://community.f

reescale.com/docs/DOC-94917•Freescalei.MX6DRAMPortApplicationGuide-DDR3https://community.freescale.com/docs/DOC-1017083IMX硬件设计指南与硬件启动医学知识讲解4/19/2023T

MExternalUse4i.MX6ReferenceSolutionRelatedMaterial1.Select“SABREPlatformforSmartDevices”2.HardwareMaterial(Schematic,PCB,Gerber.etc);4IMX硬件设计

指南与硬件启动医学知识讲解4/19/2023TMExternalUse5SABREBoardforSmartDevices(SDB)i.MX6Quad1GhzCortex-A9Processor•Canbeconfiguredasi.MX6Dual•Free

scaleMMPF0100PMIC•1GBDDR3memory(nonterminated)•3”x7”8-layerPCBDisplayconnectors•2xLVDSconnectors•Connectorfor24bit4.3”800x480WV

GAwith4-wiretouchscreen•HDMIConnectorAudio•WolfsonAudioCodec•MicrophoneandheadphonejacksExpansionConnector•CameraCSIportsignals•I2C,SSI,SPIsigna

lsConnectivity•2xFull-sizeSD/MMCcardslot•22-pinSATAconnector•10/100/1000Ethernetport•1xhigh-speedUSBOTGport•mPCI-econnectorDebug•JTAGconnecto

r•SerialtoUSBconnectorAdditionalFeatures•3-axisFreescaleaccel•eCompass•Powersupply•NobatterychargerOSSupport•LinuxandAndroid

JBfromFreescale;•Others:supportby3rdpartiesToolsSupport•Lauterbach,ARM(DS-5),Macraigordebug/IDEtoolchainPartNumbers:MCIMX6Q-SDB($399)Display(9.

7”):MCIMX-LVDS1($499)Display(4.3”):MCIMX28LCD($199)5IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TMExternalUse6SABREPlatformforSmartDevices(SDP)i.MX6

Quad1GHzCortex-A9Processori.MX6DualLite1GHzCortex-A9Processor•FreescaleMMPF0100PMIC•1GBDDR3memory(nonterminated)•3”x7”8-layerPCBDisplayconnec

tors•Native1024x768LVDSdisplay(comeswithkit)•2ndLVDSconnector•Connectorfor24bit4.3”800x480WVGAwith4-wiretouchscreen•HDMICo

nnector•MIPIDSIconnectorAudio•WolfsonAudioCodec•Microphoneandheadphonejacks•Dual1WSpeakersExpansionC

onnector•EnablesparallelLCDorHDMIoutput•CameraCSIportsignals•I2C,SSI,SPIsignalsConnectivity•2xFull-sizeSD/MMCcardslot•22-pinSATAconnecto

r•10/100/1000Ethernetport•1xhigh-speedUSBOTGport•mPCI-econnectorDebug•JTAGconnector•SerialtoUSBconnectorAdditionalFeatures•3-axisFreescaleaccel•GPSre

ceiver•AmbientLightSensor•eCompass•Dual5MPCameras•Powersupply•BatteryCharger•BatteryconnectorsOSSupport•LinuxandAndroidJBfromFreescale;

•Others:supportby3rdpartiesToolsSupport•Lauterbach,ARM(DS-5),Macraigordebug/IDEtoolchainPartNumbers:MCIM

X6Q-SDP($999)MCIMX6DL-SDP($999)Display(4.3”):MCIMX28LCD($199)WiFi:SilexWiFimodule6IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TMExternalUse7SABREPl

atformforAutomotiveInfotainment(AI)•PowerandMemory•FreescaleMMPF0100PMIC•2GBDDR3memory(i.MX6Dual/Quad)•1GB

DDR3memory(i.MX6Solo)•32GBParallelNORFlash•NANDSocketDisplay•LVDSconnector•compatiblewithMCIMX-LVDS1•ParallelRGBdisplayinterface•HDMIoutputc

onnectorDebug•JTAGconnector•DebugUARTconnectorConnectivityandExpansion•SDCardSlot•HighSpeedUSBOTG•Ethernet•SATA•MIPICS

I•PCIe•MLB150INICconnector•281-pinMXMcardedgeconnectorformainboardexpansionCanbereusedfromi.MX53SABREAIConnectivityandExpansion•SDcardslot(Wi

FimoduleorSD)•BluetoothorBluetooth+WiFiheader•AM/FMtunerheader•SiriusXMModuleheader(de-pop’’d)•GPS(UART

)moduleconnector•2xCAN•DualHighSpeedUSBHostconnectors•MLB25/50INICconnector•SPINORflashDisplayI/O•LVDSc

onnector•compatiblewithMCIMX-LVDS1•AnalogVideoInput•LVDSInputAudio•Cirrusmultichannelaudiocodec•Upto8outputs•Dualmicrophoneinputs•StereoLine

LevelInput•SPDIFreceiverOSSupport•Linux•Others:futuresupportby3rdpartiesCPUCardDetailsBaseBoardDetailsPartNumbersBaseBoard:MC

IMXABASEV1($699)CPUCards:MCIMX6SAICPU1($799)MCIMX6QAICPU1($799)Display:MCIMX-LVDS1($499)7IMX硬件设计指南与硬件启动医学知

识讲解4/19/2023TMExternalUse8i.MX6SMARTDEVICESYSTEMBlockDiagram8IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TMExternalUse9i.MX6SMARTDEVICESYSTEMSchemati

cHere,openi.MX6SabreSDSchematic,gothroughit.9IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TMExternalUse10i.MX6HardwareDevelopmentGuide.10IMX硬件设计指南与硬件启

动医学知识讲解4/19/2023TMExternalUse11Suggestion:•Pre-design:Studythedatasheet,powerconsumption,schematictounderstandourchipsetre

quirement.•In-design:Checkthehardwaredesignguide,iomuxtools•After-design:FilltheHWdesigncheckinglist,provideth

eiomuxdatatosoftware.•Hardware-bringup:Checkthepower,powersequence,clock,reset,providethebootconfigur

ationtosoftware,runddrtest.•Debugport:Suggesttohave1.USBOTGPort:Forimageprogram,YoucanuseitasUSBhostport,noproblem.MFGjustuseUSBdevicemode.

2.Debugserialport,i.MX6Xubootcanchangetosupporteveryserialportasdebugport.3.Sdcardslot:Suggesttokeepatleaston

eSdcardslot,itwillhelptousetheSdcardboot,whichcanburnimagedirectlyfromPCtoSdcard.NoneedtodebugtheMFGkernel.4.Jtag(optional

).5.SuggesttousetheGPIOBoot_cfgbutnotthefuseBoot_cfg.Andbootmodepincanbepulled,becausewecanusethenon-imageboottoenterthedownloadmod

e11IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TMExternalUse12i.MX6HardwareDevelopmentGuideHere,open<<IMX6DQ6SDLHDG.pdf>>,gothroughit.1).DesignChecklist2).i.MX6S

eriesLayoutRecommendations3).RequirementsforPowerManagement4).AvoidingBoardBring-upProblems12IMX硬件设计指南与硬件启

动医学知识讲解4/19/2023TMExternalUse13i.MXHWCheckingList.13IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TMExternalUse14i.MXHWCheckingLi

stHere,open<<HWDesignCheckingListfori.Mx6Rev2.6.xlsx>>,gothroughit.Clear1Isvoltagelevelmatchedonbus/signal

/logic/buffertwoside?Clear2Suggestdrawingpull-upsnearpinareawithpowerdomaindescriptioninschematic.Clear3Pleasetakecareclocksourcecanmeetr

equirementofperipheraldevices.(frequency/drivingcapability/jitter/tolorance/fly-timeetc.)Clear4WhenBuffer

/Levelshifter/switchareused,SIimpactiononsignalshouldbeconsidered.Clear5ThecontrolsignalspolarityforDirection

Sellect/EN/RESETshouldbecheckedforallthedevices.Clear6IOconfigurationshouldbecheckedusingIOMUXToolwhichprovide

dbyFreescale.Clear7TheTESTandFAULTmodeinputsoftheindividualchipsshouldbetiedtotheproperlevelfornormaloperation.Clear8Pinse

quence/direction/gendersofconnectorshouldbeconfirmedwithMechnicalconsideration.Clear9Pull-upsandvoltagesshouldbeverifiedforOC/ODsignals.Clear10Proper

pull-upandpull-downresistorvaluesprovidedtoavoidexcesssourcingorsinkingcurrent.Clear11Thepolaritiesofthecapsanddiodesconnect

edto–vevoltagesshouldbeverified.Clear12Suggestallactivelowsignals--include“_B”atendofthesignalnetnameandallclocksignalsinclud

e“CLK”aspartofnetname.Clear13Pleaseconfirmifallpowersourcehavesufficientpowercapacityandgoodenoughripplenoiselevelforre

quirementofpowerinput.Clear14Poweron/offsequencingshouldbeverifiedwhenmultiplepowersourcesareused.Clear15ThecurrentratingofDiodes/Inductors

usedinthepowersupplyandotherhighcurrentsectionsshouldbeprovidedproperly.Clear16PleasepayattentiononEMI/EM

C/ESD/Ligteningconsideration(decouplingcaps/TVSdiodes/chokes/filters/beads/fueseetc).Clear17Pleaseconfirmifunus

edpinsareconfiguredproperlyfollowingformalrecommend.Clear18Pleaseconfirmbootmodeandconfigurationpinsaresetproperlyandcanmeettheactualbootrequirment.

Clear19Pleasetakecarewatchdog/cold/keyresetsystemdesign,PMICandbootdevicealsoshouldberesetatsametime.14IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM15

i.MX6XPowerdesign15IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM16i.MX6PowerRelateddoc•IMX6DQCEC.pdf:i.MX6Dual/6QuadApplic

ationsProcessorsforConsumerProducts•AN4509.pdf:i.MX6Dual/6QuadPowerConsumptionMeasurement•IMX6SDLCEC.pdf:i.MX6

Solo/6DualLiteApplicationsProcessorsforConsumerProducts•AN4576.pdf:i.MX6DualLitePowerConsumptionMeasurement•SDPschematic(PF0100):SPF-27392.pdf•Sab

erliteschematic(DiscreteDCDC)(fromboundarydevices)•IMX6DQ6SDLHDG.pdf(optional):DesignChecklist:Table2-6.Powe

randdecouplerecommendations16IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM17PowerSupply,andCommonHardwareDesign17IMX硬件设计指南与硬件启动医学知识讲解4/19/2

023TM18i.MX6System-PowerDesignConsiderations•SystemPowerRequirements(oneachpowerrail)−MaxCurrentrequir

ement−Voltagerange•SystemOver-VoltageProtection•PowerOnSequencing•Systemcontrolfunctions•Layout&decouple1

8IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM19i.MX6PowerRailRequirements•ToFunctionproperly,thei.MX6Processorrequiresninedifferent

powerrails(Somemaybecombined)−VDDARM▪PowertoARMCores▪Allowedvoltage:0.9V–1.5V−VDDSOC▪VPPowertoonchipSystemPeripherals(VDDSOC_CA

P):•HDMIPHY,SATAPHY,PCIEPHY,&ARMCoreCache▪PowertoImageprocessingmodules(VDDPU_CAP)•VPU,GPU2D,GPU3D,OpenVG▪Allowedvoltag

e:0.9V–1.5V19IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM20i.MX6PowerRailRequirements(con)−VDDHIGH▪VPHPowertoonchipSystemPeripherals

(VDDHIGH_CAP)•MIPI,HDMI,SATA,PCIE,LVDS,USB,PLLs▪PowertomiscPeripherals(NVCC_PLL_OUT)•USD,PLLs,24MHzOsc.▪SharedpowerofSNVSmodule▪Allowedvoltage:

2.7V–3.3V−VSNVS▪32KHzOscillatorandSRTCfunctions▪SharedpowerofSNVSmodule▪Allowedvoltage:2.8V–3.3V20IMX硬件设计指南与硬件启动医学知

识讲解4/19/2023TM21i.MX6PowerRailRequirements(con)−USB_H1/OTG_VBUS▪PowertoUSBPHY▪Allowedvoltage:4.4V–5.25V−NVCC_DRAM▪Powersupplyfor

DRAMmemory▪Allowedvoltage:1.14V–1.575V(DependsontypeDRAM)−EthernetIOpins(NVCC_RGMII)▪Allowedvoltage:

1.14–1.9V−GeneralIOpins(NVCC_)▪Typically1.8Vor3.3V▪Allowedvoltage:1.65V–3.6V21IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM22i.MX6PowerRailRequireme

nts-Summary•Inatypicalapplication,sixdifferentvoltagesarerequiredfortheprocessortofunction:FunctionTypi

calVoltageVDDARM,VDDSOC1.375VVDDHIGH,VSNVS3.0VUSB_VBUS5.0VNVCC_DRAM1.5VNVCC_3.3V3.3VNVCC_1.8V1.8V22IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM23i.MX6Power

Requirements–VDDARM,VDDSOC•DatasheetMaxRequirementsforVDDARM:−3920mA•DatasheetMaxRequirementsforVDDSOC:−1890mA•TypicalMax

imumCurrentRequirements(AN4509):−Showingthreeseparatevideooutputs•1080pVideoplaybackHDMI•1080pVideoplaybackI

PUParallelport(LCD)•3DgraphicsthroughLVDSport▪VDDARM:1625mA▪VDDSOC:1250mA23IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM24i.MX6PowerRequirements

–VDDHIGH,VSNVS•DatasheetMaxRequirementsforVSNVS:−300uA−PullUpresistorsonVSNVSwilladdtocurrentrequirements•DatasheetMaxRequirementsforVDDHIGH:−1

60mA•TypicalMaximumCurrentRequirements(AN4509):−VDDHIGH:85mA24IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM25i.MX6PowerRequirements–DRAM

,IOPins•DatasheetMaxRequirementsforDRAM:−1900mA•TypicalMaximumCurrentRequirements(AN4509):−DRAM:1390mA•DatasheetrequirementsforIOPins,use:−I(A)=N

xCxVx(0.5xF)▪N–NumberofIOpinssupplied▪C–Equivalentexternalcapacitiveload(Farads)▪V–IOvoltage(Volts)▪(0.5xF)–Datachangerate,whereF=Frequency

(Hz)−Typical=2-3mAfora3.3Vpin25IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM26SummaryPowerRequirementsPowerRailVoltageTypicalMaximumV

DDARM1.375V1625mA3920mAVDDSOC1.375V1250mA1890mAVDDHIGH2.8V85mA160mAVSNVS3.0V-300uADRAM1.5V1390mA1900mAUSB5.0V500mA530mAI/OPins3

.3V300mA500mA*I/OPins1.8V50mA275mA**Maximumvaluesaremutuallyexclusive26IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM2

7TypicalConsumerDevicePowerRequirementsFunctionVoltageTypicalMaximumSDCard3.3V100mAWIFI/BT3.3V1000mA3G/4GModem3.3V2000mA3000mALVDS3.3/5V300/37

0mAHDMI5V50mAEthernet3.3V130mAAudio1.8/5V40/100mA80/530mASATA5V500-1000mA1500mAeMMC3.3V100mA200mACAN5V70mAGPS1.5/3.3

V20/100mACamera1.5/1.8V150/20mA27IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM28GrandTotalPowerRequirementsVoltageTypicalFu

llPower1.375V1875mA5800mA1.5V1500mA2300mA1.8V100mA350mA3.0V160mA200mA3.3V2000mA5000mA5.0V1500mA3300mA28IMX硬件设计指南与硬件启动

医学知识讲解4/19/2023TM29i.MX6System-PowerDesignConsiderations•TotalSystemPowerRequirements−TypicalSystemrequirements(5Vsource):2.9A−T

ypicalSystemrequirements(3.7Vsource):4.1A•SystemOver-VoltageProtection▪SelectPowercomponentswithhighvoltagetolerance▪DesignOver-Voltageprotectionsu

b-system▪Userbatterychargingcircuitwithprotection.•PowerOnSequencing•Systemcontrolfunctions−Stand-by,reduced

poweroptions29IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM30i.MX6System-PowerOn/OffSequencing•PowerOnSequencing1.VDD_SNVS_IN=<VDDH

IGH_IN<anyotherpowersupply(FSLsuggestVDDHIGN_INpowerwithVDD_SNVS_INorinstep2)2.VDDARM_IN<=(VDDSOC_IN-1ms);Vvddarm_cap<=(

Vvddsoc_cap+50mV):IfVDDARM_INandVDDSOC_INareconnectedtodifferentexternalsupplysources•PowerOffSequencingN/A•Notes:1.Need

toensurethatthereisnobackvoltage(leakage)fromanysupplyontheboardtowardsthe3.3Vsupply(forexample,from

theexternalcomponentsthatusebthth18Vd33Vli)30IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM31IMX6DQ6SDLHDG:Table2-6.Powerandde

couplerecommendations•VGEN5forVDDHIGH_INandincreaseto3Vtoalignwithdatasheet•Onlyone22μFbulkcapacitorshouldbeconnectedtoeacho

ftheseon-chipLDOregulatoroutputs:VDD_ARM/23/SOC/PU_CAPasnearaspossiblewithpins/vias.Thedistanceshouldbelessthan50milbetweenbul

kcapandVDD_xx_CAPpins;ripplenoiseshouldbelessthan5%Vp-pofsupplyvoltageaveragevalue•NVCC_LVDS2P5mustbepowered-onevenwhennotusingtheLVDSinterfacebecaus

eTheDDRpre-driverssharetheNVCC_LVDS2P5powerrailwiththeLVDSinterface31IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM3232i.MX6Dual/Quad:

5vINPUT+PFUSE100:SDPIMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM3333i.MX6Dual/Quad:5vDiscretePowerIMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM34Deve

lopToolsDDRStressTest34IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM35DDRStressTestTool•WhatisDDRStressTesterkit?Itisdownloa

dabletestapplicationarchitecture.AprogramrunningonPC(DDR_Stress_Tester.exe,whichrunningonCommandPromptwindow)willdownloadthetestimagetotar

getboard’sIRAMwiththehelpofUART/USBconnection.ThetestimagewilldotheDDRstresstestandtheresultwillbesenttoPCthroughUART/USBandbeprintedontheCom

mandPromptwindow.•Formx6dq,mx6dlsormx6sl,UARTisnotsupported.•Supportmx53,mx51,mx6dq,mx6dlsandmx6sl.35IMX硬件设计指南与硬件启动医学知识讲解4/19

/2023TM36DDRStressTestToolcont.TestLogLink36IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM37DevelopToolsIOMuxTool37IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM

38IOMUXTool•ApplicationWindowOverview38IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM39DownloadandInstalltheMicrosoft.NETFramework4.0•http://msdn.m

icrosoft.com/en-us/netframework/aa56926339IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM40SelectModulesandSignalsforBoar

d•ChecktheUARTS:UART1,UART2andUART3.•ExpandallsignalsunderUART3.40IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM41AccessingMuxed-SignalInfo41IMX硬件

设计指南与硬件启动医学知识讲解4/19/2023TM42AccessingMuxed-SignalInfo42IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM43ResolveConflictingSignalsSelectALT4–E

IM_D30(J20)forUART3/CTS.SelectALT4–EIM_D31(H21)forUART3/RTS.SelectALT2–SD4_CLK(E16)forUART3/RXD_MUX.

SelectALT2–SD4_CMD(B17)forUART3/TXD_MUX.43IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM44AddingCommentsforClarity•Right-clicktheUA

RT2/TXD_MUXrowintheSignalstabtobringupthecontextmenu.•Clickingonthemenuwillbringupatextentryfieldwher

etheusermayentertext.44IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM45AddingCommentsforClarity45IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM46BallDiagr

amView46IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM47Pads“Spreadsheet”View47IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM48ConfiguringIOMUXCRegisters•Select

UART3/RXD_MUXintheleft-handpane.•AlloftheIOMUXCRegistersassociatedwiththeAD4_CLK(E16)padareshownontheRegistersTab

intheright-handpane.48IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM49DragaSignaltoanotherModule49IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM

50RenameSignaltoMatchSchematics50IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM51CAN1ModulewithAllSignals•Commentsauto-g

eneratedtodenoteoriginalModule/Signal.51IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM52CodeReflectsAddedSignals•BasicCodeStyleasaTooltip.52

IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM53GenerateConfigurationCode•SeveralCode-StylesavailableintheCodeMenu.•Examplesareshowni

ntheUser’sGuide.•Click“GenerateCode”tocreatethefilesforthecurrentdesign.Tryit53IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM54i.MX6XHardwarebring

up54IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM55i.MX6XHardwarebringup:Doc&Tools.•IMX6DQ6SDLHDG.pdf:Chapter8AvoidingBoardBring

-upProblems.•IMX6XRM.pdf:Chapter7SystemBoot,Chapter60:SystemResetController(SRC)•MFGtools,DDRtesttools.•USBline;有源可限流电源，万用表，示波器55IMX硬

件设计指南与硬件启动医学知识讲解4/19/2023TM56i.MX6XHardwarebringup:Step1目视检查•检查主要器件是否有错贴的情况，比如说二极管，三极管，有没有安装位置反向或旋转的问题。•可以在PCBA时使用X光检查，有条件的使用BSDL检查来确认焊接与连线

56IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM57i.MX6XHardwarebringup:Step2电源检查•使用万用表，先空板检查每个电源有没有对地短路的情况。•使用限流电源上电，检查i.MX6X每路电源的电压是否符合我们data

sheet要求，量测电压是要求在电源输出端和i.MX6X电源输入端(越近越好，如在滤波电容上量测)都量测一下，以避免IR跌落。VDD_ARM/SOC_IN供给i.MX6X内部逻辑电路，需要仔细检查，VDD_SNVS_IN，NVCC_JTAG,NVCC_DRAM也对正常启动很重要，NVC

C_LVDS2V5也供给了DDRI/OPads,也必须要正常供给。•i.MX6X在各路电源稳定后，才能释放reset(POR_B)。•如前电源上电时序要求，检查上电时序。57IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM58i.

MX6XHardwarebringup:Step3时钟检查•一般在电源电压正确，无跌落，24Mhz和32K晶体会自动起振。•可使用示波器量测这两个时钟，如果24Mhz不工作，则系统不能启动，如果外部没有32K，或32K

不工作，则i.MX6X会自动使用内部晶振，但根据newerrataIM6DQCERev.4,07/2014:ERR007926ROM:32kHzinternaloscillatortiminginaccuracymayaffectSD/MMC,NAND,andOneNANDboot,由于内部r

omcode的GPT使用这个时钟，而GPT被用于外设访问中一些event和timeout控制，所以不稳定的时钟有可能导致romcodes读取外设失败，所以建议连接外部32K.58IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM59i.MX6XH

ardwarebringup:Step4准备bringup文档一般硬件工程师需要准备三份文档描述板级设计•电源文档:每一路电源的源，供给到?输出，输入电压，测量点,时序。如SDPschematic:59IMX硬件设计

指南与硬件启动医学知识讲解4/19/2023TM60i.MX6XHardwarebringup:Step4准备bringup文档•IOMUX文档：可以使用iomux工具导出，也可以手动准备,内容最好包括：以方便软件工程师配置IOMUX，这个表应该至少包括所有数

字管脚,软件工程师根据这个表来配置iomux文件:arch\arm\mach-mx6\Board-mx6q_sabersd.hstaticiomux_v3_cfg_tmx6q_sabresd_pads[]={…/*UART1fordebug*/MX6Q_PAD_CSI0_DAT1

0__UART1_TXD,//CSI0_DAT10为管脚名，UART1_TX会功能名。Notes:1i.MX6X基本所有的可做为GPIO的pin在reset状态下都是iomux设为gpio,gpio设为输入高阻，iopad设为100K上拉的.

2i.MX6X的datasheet中也列出了一些例外:Formostofthesignals,thestateduringresetissameasthestateafterreset,However,the

rearefewsignalsforwhichthestateduringresetisdifferentfromthestateafterreset:EIM_A16~A25,EIM_DA0~DA15,EIM_EB1~EB3,EIM_LBA/RW/WAIT,GPIO_17/19,

KEY_COL0，请注意有一些pin是用于bootgpio的.管脚名脚管序号网络名IOMUX用于CSI0_DATA10M1UART1_TXALT3UART1_TX60IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM61i.MX6XHardwa

rebringup:Step4准备bringup文档•Boot_Cfg文档：说明Boot_cfg配置，以SDP的eMMCboot为例FuseSBMR1定义GPIO管脚默认值设置值默认值定义BOOT_CFG1[7:6]Bit7_6启动设备接口EIM_DA7_600

0101:BootfromUSDHCBOOT_CFG1[5]bit5SD/MMCSelEIM_DA5010:SD/eSD/SDXC;1:MMC/eMMCBOOT_CFG1[4]bit4FastBootS

uppoEIM_DA4000:NormalBoot;1:FastBootBOOT_CFG1[3:2]bit3_2SD/MMC速度模式EIM_DA3_20000MMC:0x:HighSpeedMode;1x:No

rmalSpeedModeSD:0x:High/Normal;10:SDR50;11:SDR104BOOT_CFG1[1]bit1SDPowerCycleeMMCResetEIM_DA100MMC:0:eMMCresetdisabled.1:eM

MCresetenabledviaSD_RSTpad(onUSDHC3/4)SD:0:Nopowercycle1:PowercycleenabledvisSD_RSTpad(onUSDHC3/4)BOOT_CFG1[0]bit0SDLoo

pbackClockSourceSel(SDR50/104only)EIM_DA0000:throughSDpad1:directBOOT_CFG2[7:5]bit15_13BusWidth/SDCalibrationS

tepEIM_DA15~13000010SD:BusWidth:xx0:1bit;xx1:4bit.SDCalibrationStep:00x~11x:1~3delaycellsMMC000~010:1,4,8bit.1

01~110:4,8bitDDR(MMC4.4)61IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM62i.MX6XHardwarebringup:Step4准备bringup文档SDP的BootSelect为:所以eMMC启动

的SBMR1=0Xxxx5860FuseSBMR1定义GPIO管脚默认值设置值默认值定义BOOT_CFG2[4:3]Bit12_11启动设备接口EIM_DA12_11001100~11:USDHC1~4BOOT_CFG2[2]B

it10DLLOverride(eMMC)EIM_DA10000:BootROMdefault;1:ApplyvalueperfuseMMC_DLL_DLY[6:0]BOOT_CFG2[1]Bit9BootACKdisable/PulldownDuringPowerCycleEnableEIM_

DA900MMC:0:BootACKEnabled;1:BootACKDisabled.SD:0:UsethedefaultSDpadsettingsduringpowercycle.1:SetPulldownonSDpadsduringpowercycleBOOT_

CFG2[0]bit8OverridePadSettingsEIM_DA8000:Usethedefaultvalues.1:UsePAD_SETTINGSvalues.62IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM63i.MX6XHardwa

rebringup:Step5确认启动配置i.MX6X在上电正确，时钟正确，POR正确后，会首先执行内部的ROMcodes，这个ROMcodes,首先会读取SBMR2寄存器的值，来判断启动模式，如果为下载模式，则进入下载模式。如果为正常启动模式则会根据读取SBMR1寄存器的值来初始化相应启动设备的

控制器，并尝试去读取相应设备上的镜像，并认证。如果认证成功，则根据镜像开头的数据结构来初始化外部DDR，然后将镜像拷贝到外存，并跳转到外存执行bootloader。如果镜像认证失败，则又进入下载模式。进入下载模式后，i.MX6X会通过USBOTG口与hostPC联系，并报告为一个HID

设备。所以从PC上可以看到一个USBHID设备信息。如果有这个信息报出，证明i.MX6X的最小系统工作了(电源，时钟，POR，内部ROMcodes已经执行并进入了下载模式)。如果我们已经设置为正常启动模式，并且配置boot_cfg相应的GPIO，则可以使用示

波器量测启动设备上相应的时钟：•Nand:CEpinforreadenableclock•SPI-NOR:SlaveSelectorClockpin.•MMC/SD:SD_CLKpin.如果有时钟，则说明ROMcodes已经开始读取相应启动设备，硬件Boot_cfgGPIO配置是正

确的。如果没有，则说明Boot_cfgGPIO配置可能有问题，需要再次检查硬件。63IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM64i.MX6XHardwarebringup:Step6测试外部内存i.MX6X最小系统工作以后，下一步需要保证外部内

存已经工作了，这样才可以确保bootloader软件可以工作。所以接下来需要测试外部DDR.•根据DDRdatasheet,使用Mx6DQSDLDDR3ScriptAid工具来生成DDR初始化脚本。•连接硬件，运行DDR_Stress_Tester.ex

e•–tmx6x–dfMX6QD_SabreSD_DDR3_528MHz_64bit.inc，根据提示来校准DDR及进行压力测试。如果压力测试通过，则说明外部DDR工作正常。•DDR测试详细请参看文档MX6X_DDR3_调校_应用手册_V1.doc•DDR初始化脚本可作为bootloade

r中的DDR初始化数据结构用,在文件:uboot\board\freescale\mx6q_sabersd\flash_header.s•使用\u-boot-2009.08\include\confi

gs\mx6q_sabresd_iram.h可以编译出基于内部iRam运行的uboot,对比运行在外部DDR的uboot可以判断是否为外部DDR问题。64IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM65i.MX6XHardwar

ebringup:完成以上步骤完成后，则可以初步说明i.MX6X系统(i.MX6X，电源，外部DDR)工作正常。可以进行接下来的软件bringup工作。软件定制基本包括:•根据DDR初始化脚本来配置uboot的flash_header数据结构。•根据IOMUX文档来配置uboot和内核的iomu

x数组。•根据板级的外设情况来准备一个相对较小的内核，并编译出MFG和正常内核。•使用MFG烧写启动设备，调试MFG内核。•烧写成功后，启动，如果有uboot串口消息打出，则可以使用串口消息来继续调试。65IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM66i.

MX6XHardwarebringup:一些调试方法１:确认启动配置刚才说到可以通过量测启动设备相应的管脚clock信号来判断Boot_cfg设置是否正确，而如果MFG及MFG镜像可以工作，也可以使用MFG直接读取SBMR1寄存器来获取：1.将M

FG的uboot换成正常启动的uboot，即替换掉\Mfgtools-Rel-4.1.0_130816_MX6Q_UPDATER\Profiles\MX6QLinuxUpdate\OSFirmware\u-boot-m

x6q-sabresd.bin(MFG的uboot和正常启动的uboot对比一个不同就是MFG的uboot取消了等待3S输入的功能，而正常的uboot可以)2.启动板子，进入下载模式(bootmode为下载，或是启动镜像认证失败都会进入)。3.进入下载模式后就可以运行MFG，

将正常启动的uboot镜像下载到外部内存并运行起来。4.在串口上键入“空格”，停下uboot,然后使用uboot的”md”命令就可以读取sbmr1寄存器：”md020d8004”(sbmr1寄存器地址)，在SDP,eMMC启动时为0x00005860，与上文我们配置的一致。所以总结下来如果系

统因为启动模式不对而进入到下载模式，我们可以通过MFG来精确确认SBMR1寄存器值，从而了解是那些Boot_CfgGPIO配置不对。66IMX硬件设计指南与硬件启动医学知识讲解4/19/2023TM©2014FreescaleSemiconductor,Inc.|Ext

ernalUsewww.Freescale.com67IMX硬件设计指南与硬件启动医学知识讲解4/19/2023