【文档说明】pcb板制作工艺流程介绍.pptx，共(49)页，2.010 MB，由精品优选上传

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HDIManufacturingProcessFlowPre-engineeringPatternimagingEtchingLaminatingDrillingCuplatingHolepluggingPatternimagingLaminationLaserAblationMe

chanicaldrillingPatternimagingCuplatingSolderMaskSurfaceFinishedRoutingVisualinspectionElectrictestShippingPre-engineeringPatte

rnimagingEtchingLaminatingDrillingDesmearCuplatingHolepluggingCuplatingBeltSandingLaminationLaserAblationMechanicaldrillingCuplatingPatternimagin

gSolderMaskGoldplatingRoutingElectricaltestPatternimagingHolecounterShippingVisualinspection1.內層基板(THINCORE)LaminateCopperFoil裁板(PanelSize)COPP

ERFOILEpoxyGlassPhotoResist2.內層線路製作(壓膜)(DryFilmResistCoat)EtchPhotoresist(D/F)PhotoResist3.內層線路製作(曝光)(Expose)A/WArtwork(底片)Artwork(底片)AfterE

xposeBeforeExpose4.內層線路製作(顯影)(Develop)PhotoResist5.內層線路製作(蝕刻)(Etch)PhotoResist6.內層線路製作(去膜)(StripResist)7.黑氧化(OxideCoatin

g)8.疊板(Lay-up)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)9.壓合(Lamina

tion)典型之多層板疊板及壓合結構...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板10-12層疊合壓合機之熱板壓合機之熱

板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板墊木板鋁板10.鑽孔(Dr

illing)11.電鍍Desmear&CopperDeposition12.塞孔(HolePlugging)13.去溢膠(BeltSanding)14.減銅(CopperReduction)→Option15.去溢膠(BeltSanding)→Option16.外層壓膜DryFilmL

amination(Outerlayer)PhotoResist17.外層曝光ExposeUV光源18.AfterExposed19.外層顯影Develop20.蝕刻Etch20.去乾膜StripResist21.壓合(Buil

d-upLayerLamination)RCC(ResinCoatedCopperfoil)21.護形層製作(壓膜)(ConformalMask)DryFilm(乾膜)DryFilm(乾膜)Artwork(底片)Artwork(底片)22.護形層製作(曝光)(Conformal

Mask)BeforeExposureAfterExposure23.護形層製作(顯像)(ConformalMask)24.護形層製作(蝕銅)(ConformalMask)25.護形層製作(去膜)(ConformalMask)26.雷射鑽孔(LaserAblation)及

機械鑽孔MechanicalDrill(P.T.H.)LaserMicrovia(BlindVia)27.機械鑽孔(MechanicalDrill)28.電鍍(Desmear&CopperDeposition)29.外層線路製作(

Patternimaging)壓膜(D/FLamination)曝光(Exposure)顯像(D/FDeveloping)蝕銅(Etching)去膜(D/FStripping)30.防焊(綠漆)製作(SolderMask)WWEI

94V-0R10531.S/M顯像(S/MDeveloping)32.印文字(LegendPrinting)33.浸金(噴錫……)製作(ElectrolessNi/Au,HAL……)WWEI94V-0R105WWEI94V-0R

105DedicateoruniversalTesterFlyingProbeTester34.成型(Profile)35.測試(ElectricalTesting)WWEI94V-0R105WWEI94V-0R10536.終檢(FinalIn

spection)37.O.S.P.(entekplusCu_106A….)→OptionLASERBLIND&BURIEDVIALAY-UPA=THROUGHVIAHOLE(導通孔)B=BURIEDVIAHOLE(埋孔)C=OneLevelLase

rBlindVia(雷射盲孔)LASERBLIND&BURIEDVIALAY-UPBURIEDVIAANDLASERBLINDVIAOPTION(雷射盲埋孔之選擇)DCCD=TwoLevelLaserVia(雷射盲孔)CDCB-STAGE

FR-4CoreRCCFR-4CoreB-STAGERCCABBABURIEDVIALAY-UPA=THROUGHVIAHOLE(導通孔)B=BURIEDVIAHOLE(埋孔)C=BLINDVIAHOLE(盲孔)D=BLINDHOLEMLBVIA(多層盲孔)B

LINDVIALAY-UPBLINDVIASEQUENTIALLAY-UPABBARESINB-STAGEBLINDANDBURIEDVIAOPTION(盲埋孔之選擇)DACCE=VIAINPAD(VIP)(導通孔在p

ad裡面)EConventionalPCBFR-4Build-upLayerBuild-upLayerPhoto-viaPhoto-ImageableDielectric(PID)FR-4ConventionalPTHConventionalPTHConventionalPCBBlin

dViaPCBPTH3millineSVHIVHChip-on-SVHFR-4ConventionalPTHConventionalPTH