【文档说明】PCBA不良分析.pptx，共(31)页，10.600 MB，由精品优选上传

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Defectmode:BURNTVersion:加温过度Defectmode:CleanlinessVersion:不洁Description：洁净度不够，如有助焊剂残留等Defectmode:coldsolderVersion:冷焊De

fectmode:ContaminationVersion:玷污Description：污染Defectmode:coplanarityVersion:不共面Defectmode:Defectivefan

PCBAVersion:风扇线路板故障Defectmode:DelaminationVersion:分层Description：PCB组装后分层Defectmode:DewettingVersion:去湿D

escription：焊盘或端子，引脚不沾锡Defectmode:ExcesssolderVersion:焊料过多Defectmode:ExcessiveleadlengthVersion:引脚过长Defectmode:Exposed

copperVersion:露铜Defectmode:IcicleVersion:锡尖Description：触点处有遗留焊尖Defectmode:IncorrectleadformVersion:引脚变形Defectmod

e:InsufficientleadVersion:引脚不够突出Description：引脚长度不够，未伸出板，不可辨认Defectmode:InsufficientsolderVersion:焊料不足Defectmode:MisalignmentVersion:

方向偏离Description：对位不准Defectmode:MissingcomponentVersion:组件缺失Description：缺少零件Defectmode:ParticulatematterVersion:颗粒物质Description：有杂质，有异物Defect

mode:RaisedcomponentVersion:组件突起Description：元件抬高，浮起Defectmode:ReversedcomponentVersion:元件装反Defectmode:Scratches/gougesVersion:划伤，沟槽Defe

ctmode:Solderball/splashVersion:锡球/锡渣Defectmode:SolderbeadingVersion:焊锡连珠Description：锡珠Defectmode:SolderbridgeVersion:锡桥Defectmode:SoldercavityVe

rsion:焊穴Defectmode:SolderabilityVersion:可焊性Description：焊接性不好Defectmode:TombstoningVersion:元件竖立Description：墓碑Defect

mode:unsolderedleadVersion:引脚未焊接Defectmode:WarpedVersion:扭曲Description：组装后的成品PCBA扭曲，翘曲Defectmode:WrongcomponentVers

ion:组件错误Description：用错料Defectmode:WrongrevisionVersion:版次错误