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PresentedbyNinaMiaoNDC2004-02Ver.2.0.1.4PadstackDetails2.2.4Packageoutline.BoardDesign3.1BoardOutlineBoardDesign(Cont.)BoardDesign(Cont.
)BoardDesign(Cont.)BoardDesign(Cont.)4.3milsPrepreg~48milsCore:FR44.5milsPrepreg=60Ω±10%。BoardDesign(Cont.)Layou
tProcess4.2Bringtheschematicdata4.3ImportlogicinformationLayoutProcessConceptLogicImportThird-P
artyLogicImport5.1Therearefourtypesofdesignrules:5.1.1SpacingRuleSet:Clearancesbetweenlines,pads,vias,andcopperareas(shapes)5.1.2PhysicalRuleSet
:Linewidthandlayerrestrictions5.1.3DesignConstraints:Packagechecks,soldermaskchecksandnegativeplaneislandchecks5.
1.4ElectricalConstraintSets:Performancecharacteristics(crosstalkandpropagationdelay).6.1Theprerequisitesformanualp
lacementare:6.1.1Symbols:Thepackagesymbolsandpadstacksrequiredforpartsinthenetlistmustexist.6.1.2Netlist:Youmustlo
adaschematicdatabaseintoanAllegrodesignfile(.brd).6.1.3Floorplanning:Youcancreatea“blockdiagram”ofthelogicalfunctions
thatneedtobearrangedontheboardbyusingRooms.6.ComponentPlacement(Cont.)Createroomsforfloorplanning.Assignreferencedesignators
to"preplaced"devices.PlaceI/Obounddevices.Placecriticallogicfunctions.Evaluateandreviseplacement.Placebulkdecouplingandbypasscaps.
Usereportstoaidplacementprocess.6.ComponentPlacement(Cont.)Placethemechanicalsymbol.Addformatsymbols.A
ddpackagesymbols.Setcolorandvisibility.Definethecrosssection(layerstackup).7.1Interactiverouting
modesDefinenetpropertiesbeforeaddingetch.Commonnetpropertiesusedwithinteractiverouteare:MIN_LINE_WIDTHMIN_NECK_WIDTHNO_RATFIXEDAddings
ignalconnectionsDeletingsignalconnectionsInsertingvias.7.2AutomaticRoutingmodes9.1Bareboarda.Electricalcontin
uitycheck(opensandshorts)b.PerformedafterfabricationAfterthephysicalboardhasbeenmanufactured,itistestedforcontinuitybythefa
bricationfacility,knownasbareboardtest.Thistestcheckstheconnectionsbetweenallcomponentpins,andensuresthatno“sh
orts”or“opens”exist.9.2In-circuita.Logicalperformancecheckb.PerformedafterassemblyQ&A