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伟创力校企合作项目培训课程名称：PCBA制程工程技术概论与基础(PE+EE)编写部门：测试工程Name:KhooTeeWanDate:10Jan20102Contents内容PageObjectives目的Page-3Cany

ouimagineworldwithoutelectronics你能想象世界没有电子的情景吗？Page-4ElectronicsIndustrySectors电子工业部门Page-5ElectronicsIndustryand

SMT电子工业和自动粘贴技术Page-6PCBPackagingTypePCB封装方式Page-7WhymixedtechnologyPCBpackaging?为什么有混合的封装方式Page-8SMTandMixedTechn

ologyAssemblyTypesＳＭＴ和多样的组装技术Page-9GeneralConsiderationsforPCBPackagingＰＣＢ封装考量通择Page-10SurfaceMountTechnology表面粘贴

技术Page-13OverviewofSMTProcessSMT制程概述Page-19SolderPrinting锡膏印刷Page-21Pick&PlaceProcess选择和放置零件Page-23Contents3Contents内容PagePostReflowProcess

回流焊Page-28WaveSolder波峰焊Page-40WaveSolderandThroughHoleAssemblyProcess波峰焊和插件组装制程Page-44Contents4Bytheendofthismodul

e,youwillbeableto:•Describeelectronicspackagingandsurfacemounttechnology(SMT)•Comparedifferentassemblytypes•Identifythedifferentas

semblyprocessesformakingthePrintedCircuitBoard(PCB)assembly•IdentifySMTcomponentsObjectives目的到本单元结束时，您将能够：•描述电子产品包装和表面贴装技术（SMT）•比

较不同的装配类型•识别不同的装配工艺制造的印制•电路板(PCB）组装SMT元件识别5CanyouimagineaworldwithoutElectronics?你能想象世界没有电子的情景吗？6ElectronicsIndustryComputer&BusinessEquipment•Cal

culator,PCs,Notebooks,Copiers,Servers,etc.Industrial&MedicalSystems•Controls,Robots,Implants,HearingAids,et

c.ConsumerElectronics•VCRs,Camcorders,Audio,Headsets,Games,etc.Automotive•Entertainment,Airbags,ABS,Ignit

ionControl,etc.Communications•MobilePhones,Pagers,Headsets,LANCards,etc.ElectronicsIndustrySectors电子工业部门计算机和

商务设备计算器，电脑，复印机，服务器，等工业和医疗系统控制器。机器人，注入，听力，辅助，等消费电子盒式磁带录像机摄像机音箱耳机游戏，等汽车娱乐安全气囊防抱死制动系统点火控制，等通信电子手机传呼机耳机网卡电子工业7Whatis

SurfaceMountTechnology(SMT)?什么是表面贴装技术（SMT）？•Amodernformofcomponentandassemblyprocesstechnology一种现代的元件和组装工艺技术•Usedbyelectronicsindustrytomanufact

urePrintedCircuitBoard(PCB)assemblies用于电子工业的印刷电路板（PCB）组装ElectronicsIndustryandSMT电子工业和自动粘贴技术8AlsoreferredtoasInsertionMountTechnolo

gy也被称为插入安装技术ElectroniccomponentsareInsertedintoholesinthePCB电子元件插入到PCB的孔里TechnologywhichisaCombinationofSurfaceMountandThroughHoleTechnology这是一种表

面贴装和通孔技术的组合ElectroniccomponentsAredirectlyplacedandAttachedtothesurfaceofthePCB.电子元件，直接安置和粘贴到PCB表面PCBAssemblyT

ypesPCB组装方式9•Unavailabilityofoddshaped,highpower,andspecializedcomponents.奇怪形状，高功率，和一些特殊的元件不能用单一的组装技术。•Moreinve

stmentrequiredtosetupafullSMTprocess建立一个全套的SMT制程需要更多的投资。•Inmanycasesitischeapertousethroughholecomponents插件元件在许多情况下是便宜的•THTismorerobus

tandisnecessaryincertainapplications插件在某些应用中更可靠和必要WhymixedtechnologyPCBassembly?为什么有混合PCB组装技术1SMTandMixedTechnologyAssemblyTypesS

MT和混合组装技术类型1ElectricalConsiderations电器考量•PCBassemblydensityPCB组装密度•Powerrequirements电源需求•Powerandsignaldistri

bution电源和信号分布•Input/Outputrequirements输入输出需要•Noise&Crosstalkbetweentraces,pads,layers,etc.PCB线路之间，焊盘之间,层与层之间的杂讯和共鸣•Hazardousvolta

geisolation危险电压的隔绝•Componentselection元件的选择ManufacturingConsiderations生产的考量•Assemblytypeandcomponentmix装配型号和元件的混合•Ma

nufacturingprocesscapability生产制程能力•Boardmaterial板材料•Inter-packageSpacing元件脚间距•Landpatterndesignandfootprintorientation焊环图案设计和器件

封装方向•Productvolume产品量GeneralConsiderationsforPCBassemblyPCB组装的一般考量1ThermalConsiderations热考量•Inter-packagespacing元件脚

间距•Thermalexpansionmismatch热膨胀系数不匹配•Glasstransitiontemperature玻璃化温度•Processingtemperatures加工温度•Operatingconditions工作条件•Thermalmanagementrequ

irements热管理要求Costconsiderations成本考量•PCBcostPCB成本•MaterialofthePCB物料成本•NumberoflayersPCBＰＣＢ层数•Tracewidthandspace线路宽度和空间•Viarequir

ements过孔要求•Specialfinishrequirements特殊表面处理要求•Componentcost元件成本•Assemblyequipmentcost组装成本•Processingcost工艺成本GeneralConsideratio

nsforPCBAssemblyPCB组装一般考量1MaterialConsiderations物料考量•Materialproperties材料特性•Compatibility兼容性•Applicationrequirements运用需求•Pro

cessingrequirements工艺需求•Cost成本•Thermal,electricalandmechanicalperformance/properties热，电气和机械性能/特性OtherCon

siderations其他考量•Designfor…设计考量。Manufacture&Assembly制造和组装Test测试Inspection检查Cost成本Procurement采购Service服务Environment环境•Protectionf

romenvironmentaldamagecorrosionofcontacts从预防环境损害和接触腐蚀•Connectionfailuresduetoshock,vibrationandflexing

ofPCBs由于冲击，振动和弯曲的PCB造成的连接失败。•Reliabilityofassembly组装的可靠性•Frictionalwearofconnectors连接器的摩擦磨损•Procurementandleadtime采购和准备时间GeneralConsider

ationsforPCBassemblyPCB组装的一般考量1WhySurfaceMountTechnology?为什么有表面粘贴技术•Enablessignificantsizeandweightreduc

tion可显着减少尺寸和重量•Providesimprovementinelectricalperformance改善电气性能•OffersreasonablesolutionforhighpincountICs提供高引脚数集成电路合理的解决方案•Ma

nufacturingassemblyismoreeasilyautomated生产装配更容易自动化•Offersthepotentialforsignificantcostreductions提供了降低成本的巨大潜力SurfaceMountTechnology(SMT)表面粘贴

技术(SMT)1SurfaceMountTechnologyPerformance–表面粘贴技术性能•Primemotivationisincreaseddensityandboardareareduction。主要目的是提高板密度和减少面积❑Smallerdevice

s(activesandpassives)小体积的主动元件和被动元件❑DIPsover40pinswereimpractical超过40支脚的插件元件是不切实际的❑Two-sidedmounting两面粘贴•SMTresu

ltsinabetterproductSMT可以生产出一个更好的产品❑Samefunctionsforlessspace小的空间可以得到同样的功能❑Morefunctionsforsamespace同样的空间，跟多的功能❑Lessele

ctricalsignaldelays信号延迟少❑Lessmass,bettervibrationresistance更好的抗震性•InmanycasesSMTwasrequiredtomaketheproduct

feasible很多案例中,SMT让产品成为可行SurfaceMountTechnology(SMT)表面粘贴技术(SMT)1•SMT-Amodernformofcomponent&assemblyprocesstechnology,tomanufacturePCBassembli

esSMT，一个现代PCB和元件组装工艺技术•ElectroniccomponentsaredirectlyplacedandattachedtothesurfaceofthePCB电子元件，直接安置和附着于印刷电路板的表面SurfaceMountTechnology(SMT)表面粘贴技术(SM

T)1•SMTComponentsSMT元件SurfaceMountTechnology(SMT)表面粘贴技术(SMT)1SurfaceMountTechnology(SMT)表面粘贴技术(SMT)•SMTCo

mponentsSMT元件1SurfaceMountTechnology(SMT)SMTAssemblyTypes表面贴装类型•SurfaceMountactivesorpassivesononeorbothsides

ofthe主动性和被动元件贴装在PCB的一面或双面•Applications运用❑Mostwidelyusedwherehighestdensityisdesired最广泛的使用于高密度板❑Typicallyrequires4layersminimum通常最少

需要4层板❑SpaceSavings:Savingsofupto60-70%areattainable空间节省：可以实现高达60-70％是的节余2HowarePCBsassembled?PCBA怎样组装？WaveSolder波峰焊HandPlacement手摆放VisualInspecti

on目检ICT在线测试PCBPreparationPCB准备PCBA测试RawComponent原始零件FT功能测试OverviewofSMTProcessSMT制程概述SMTProcessSMTSolderPrinting锡膏印刷Pick&Place选择和放置零件PostReflow回流焊2So

lderPrinting锡膏印刷Whatissolderprinting?什么是锡膏印刷•ProcessoftransferringsolderpasteontothepadsofaPCB,byforcin

gitthroughmatingaperturesonastencil,usingasqueegee。用刮刀使用压力，使锡膏通过匹配的模具上的小孔，转移到PCB的焊盘的过程.2CircuitBoard线路板•Usetoprovideinterconnecttra

cesbetweencomponents提供元件间的相互连接Stencil钢板•Vehiclebywhichthevolumeandplacementlocationofsolderpastedepositionisco

ntrolled控制锡膏流量和放置位置的媒介SolderPaste锡膏•Mixtureofsolderspheresandfluxdepositedontopadsofcircuitboardonacontrolledvolume.

Afterreflowprovideselectrical,mechanicalandthermaldissipativeconnectionbetweencomponentandboard焊料和助焊剂的混合，定量的转化到线路板的焊盘

上。经过回流，提供元件和线路板之间的电气，机械和热耗散连接SolderPrinting锡膏印刷2Squeegee刮刀•Criticaltoolusedto“push”pastethroughthedesignatedopenings.Variationsinhard

ness,flatness,speed,angleandpressurecriticallyimpactqualityoftheprint用于通过指定的开孔推动锡膏的关键工具。硬度，平整度，速读，角度和压力关键变量影响印刷的质量。Print

er印刷机•Machinewhichdepositssolderpasteontopadsonthecircuitboard将锡膏放到线路板上的机器SolderPrinting锡膏印刷2Pick&PlacePr

ocess选择和放置零件2•AflexiblemachinethatplacesmanydifferenttypesofcomponentsonaPCB灵活的机器，可以在一块PCB上放置许多不同类型的元件•MostimportantpieceofequipmentintheSMTassembly

process在SMT组装制程中最重要的一种设备。•Veryexpensive很昂贵•Withouttheuseofappropriatefeedersandamachinevisionsystem,theplacementequipmentwillnotbeabletopick

&placecomponents如果没有适当的进料器和机器视觉系统的使用，安置设备将无法取放组件。•Itincludesfeaturessuchas:它包括以下的功能：❑Reliableplacementaccuracy可靠的放置精度❑Vacuumpic

kupcapability真空提取能力❑Automaticcomponentrealignment元件自动对准❑Visionsystem视觉系统❑TransportationsystemforPCBsPCBs运输系统Pick&PlacePr

ocess选择和放置零件2•FactorsinfluencingtheuseofautomatedplacementequipmentinSMT在SMT中影响自动贴装设备的使用的因素Handlingofcomponents,especiallysmallchipsandultra-finepit

chleadeddevices元件的手动搬运和操作，尤其是小芯片和超细间距引线的器件❑Throughputrequirements吞吐量需求❑ReliabilityandAccuracy可靠性和准确性❑Q

uality质量❑Flexibility灵活性Pick&PlaceProcess选择和放置零件零件进料PCB搬运育龄舰对准板办对准放置头机械手机壳2Pick&PlaceProcess选择和放置零件NormalPickUp正常的提取•Z-Axismovestil

lcomponentistouchedZ-轴移动直到接触到元件•ThenZ-Axismovesbackandcomponentispickedup，然后，Z-轴移回原来的地方，元件被提起来TouchlessPickUp无接触的提取•Z-Axismovestoafixed

heightabovethecomponentZ-轴移动到元件上方一个固定的高度•Componentissuckedoutofthepocket元件被吸出袋外2PostReflowProcess回流焊Whatispostreflowprocess?什么是回流焊？•Processof

joiningmetallicsurfacesthroughthemassheatingofsolderorsolderpaste是通过大量加热，使锡膏受热融化从而让表面贴装元器件和PCB焊盘通过焊锡膏合金可靠地结合在一起的制程。•Createsamecha

nicalandelectricalconnectionbetweenthecomponentsandPCB在PCB和元件之间创建一种机械和电器的连接Surfacemountcomponentsaresecuredonthesurfaceandaredepende

ntonsoldervolumeformechanicalstrength表面粘贴元件依靠一定量的锡膏由于机械强度被固定在表面•Solderalloymetalismeltedtoformtheconnection合金焊料融化后，形成连接•Liquidsolderattaches

tothebasemetalsbyformingintermetalliccompounds,throughtheprocessofwetting液态焊料由金属间化和物，通过润湿流程附着在金属表面。2Post

ReflowProcess回流焊Requirementforsoldering–回流焊的需求❑SourceofSolder–Alloy焊料-合金❑SourceofHeat热源❑Flux助焊剂❑CompatibleMetallization兼容金属❑Clea

nSurfaces表面清洁❑ControlledProcess被控制的流程3PostReflowProcess回流焊•SurfaceMountandThroughHoleSolderJoints表面焊接和通孔焊接3PostReflowProcess回流焊•Inthesolderingpro

cess,threedifferentheatingmethodsareused三种不同的加热模式用在焊接制程中。❑Conduction热传导❑Convention热对流❑InfraredRadiation(IR)红外辐射•Differentheatt

ransfermethodsofferdifferentadvantagesanddisadvantages不同的热传输模式有不同的优势和劣势3Conduction热传导❑Conductionoccurswhentwosolidmassesofdiffere

nttemperaturesareincontactwitheachother热传导发生在不同温度下的两个固体相互的接触❑Providesuniformproductheatingasheatwillconductfromah

otspottoacoldspotintheproduct供给均匀的热，由于热能将从热的一端传到冷的一端。PostReflowProcess回流焊3Convection--热对流•Convectionheattransfe

roccurswhenafluid(suchasairornitrogen)flowsovertheobjecttobeheated热对流发生在气体吹过目标物（如空气或氮气）。•Twotypes-NaturalConvectionandForcedCo

nvection两种方式-自然对流和强制性对流❑Naturalconvectionoccurswhennoflowisbeingforcedovertheobject自然对流发生于没有气体被强制流过目标物。❑Forcedconvectionrequiresanexte

rnalforcethatpushesorpullstheflowovertheobject强制对流需要一种外部的压力推动或拉动气流流过目标物。•Mostsolderingovenstodayuseforce

dconvectionastheprimaryheattransfermethod今天大多数焊接烤箱使用强制对流作为换热模式预热的主要方法PostReflowProcess回流焊3InfraredRadiation(IR)红外辐射❑Infraredradiation(IR)occurswh

entwobodiesofdifferenttemperaturesareinsightofeachother红外辐射发生与当两种不同温度的物体在相互的视野内❑Heatistransferredbytheelectromagnet

icwavesgeneratedbythehotbody热被产生于热物体的电磁波转换。❑Twoimportantphenomenonwithradiation:两种重要的辐射现象Absorbtivity:Percentageofinfraredabso

rbedbythePCBandcomponents吸收：被PCB和元件吸收的百分比BlackBody:Abodythatabsorbsallradiationincidentuponitssurface黑体：吸收所有表面辐射的物体Po

stReflowProcess回流焊3PostReflowProcess回流焊❑SolderingSurfaceMountComponents表面粘贴元件SolderingReflowVaporPhaseI

RForcedConvectionWaveSoldering焊接回流焊波峰焊蒸气红外辐射强制对流3AllthesolderedconnectsArecreatedinasinglestep所有的焊接在一个步骤完成ThesolderedconnectionsareCreatedoneaf

teranother焊接在一个步骤接着另一个步骤地完成•SolderingThroughHoleComponents插件元件PostReflowProcess回流焊SolderingthroughHoleComponentsSimultaneousSequential插件元件一次性的连续

性的3SimultaneousDipsolderingWaveSolderingwithsolderresistPostReflowProcess回流焊•SimultaneousSoldering一次性的浸焊有防焊的波峰焊

3SequentialIronSolderingMini-flowsolderingLightSolderingLaserSolderingFlameSolderingPostReflowProcess回流焊•SequentialSoldering连续性的焊

接持续性焊接烙铁焊小热风焊光波焊接镭射焊接火焰焊接3PostReflowProcess回流焊•GrowthTrend增长趋势4WaveSolder波峰焊Wave-soldermachinemodule波峰焊机器模组•Conveyor传送带•SprayFluxer

助焊剂喷洒机•Preheat预热器•SolderPot&Nozzles焊接棒和焊嘴4WaveSolder波峰焊•WaveSolderMachineLayout波峰焊机器分布进入喷洒助焊剂一区二区三区微波风刀冷却区输出风刀加热区-典型的强制热度对流层

流波/振荡波4WaveSolder波峰焊波峰后的PCBA焊波喷洒助焊剂预热波峰焊冷却4AssemblyPreparationforWaveSoldering波峰焊的准备•Fullyautomatedormanualinspectionoftheassemblytoverify:全部制动或手动目检o

Presenceorabsenceofvariouscomponents元件的存在和缺件oComponenttypeandorientations元件型号和方向oDamagedboards撞板oBadcomponentclinchingonthebotto

mside底面的损件•Selectivesoldermaskingusingtemporaryliquidsoldermaskortape,topreventsolderfromattachingtosp

ecificareasofthePCBassembly选择性焊锡屏蔽使用临时液态防焊或胶带，以防止焊料附着在PCB组装的指定的领域。•Addingedgesupportsfortheboard,topreventwa

rpingofthinboards添加边缘支持，以防止薄板弯曲WaveSolder波峰焊4WaveSolderandThroughHoleAssemblyProcess波峰焊和插件组装流程RawPCBDIPInsertionRadialInsertion

Odd-FormInsertionApplyTemporarysoldermaskIsPCBofstandardthickness?WaveSoldering**InsertionofTemperatureSensitiveComponentsSelectiveSolderingo

fTemperatureSensitiveComponentsRemoveTemporarySolderMaskAddBoardStiffnessForthinboards增加板的刚度Yes(StandardThickness=62-mils)标准厚度空

板插件径向插入多种方式插件运用临时防焊PCB是标准厚度吗？温度敏感元件的插入温度敏感元件的可选择性焊接去除临时防焊物Inspection/Cleaning目检和清洁…….No不是4WaveSolderandThroughHoleAssemblyProce

ss波峰焊和插件流程4Thanks!