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伟创力校企合作项目培训课程名称：PCBA制程工程技术概论与基础(PE+EE)编写部门：测试工程Name:KhooTeeWanDate:10Jan20102Contents内容PageObjectives目的Page

-3Canyouimagineworldwithoutelectronics你能想象世界没有电子的情景吗？Page-4ElectronicsIndustrySectors电子工业部门Page-5ElectronicsIndustryandSMT电子工业和自动粘贴技术Page-6

PCBPackagingTypePCB封装方式Page-7WhymixedtechnologyPCBpackaging?为什么有混合的封装方式Page-8SMTandMixedTechnologyAssemblyTypesＳＭＴ和多样的组装技术Pag

e-9GeneralConsiderationsforPCBPackagingＰＣＢ封装考量通择Page-10SurfaceMountTechnology表面粘贴技术Page-13Overviewof

SMTProcessSMT制程概述Page-19SolderPrinting锡膏印刷Page-21Pick&PlaceProcess选择和放置零件Page-23Contents3Contents内容PagePostReflowProcess回流焊Page-28WaveSolde

r波峰焊Page-40WaveSolderandThroughHoleAssemblyProcess波峰焊和插件组装制程Page-44Contents4Bytheendofthismodule,youwillbeableto:•Describee

lectronicspackagingandsurfacemounttechnology(SMT)•Comparedifferentassemblytypes•IdentifythedifferentassemblyprocessesformakingthePrintedCir

cuitBoard(PCB)assembly•IdentifySMTcomponentsObjectives目的到本单元结束时，您将能够：•描述电子产品包装和表面贴装技术（SMT）•比较不同的装配类型•识别不同的装配工艺制造的印制•电路板(PCB）组装SMT元件识别5Canyouimag

ineaworldwithoutElectronics?你能想象世界没有电子的情景吗？6ElectronicsIndustryComputer&BusinessEquipment•Calculator,PCs,Notebooks

,Copiers,Servers,etc.Industrial&MedicalSystems•Controls,Robots,Implants,HearingAids,etc.ConsumerElectronics•VCRs,Camcorders,Aud

io,Headsets,Games,etc.Automotive•Entertainment,Airbags,ABS,IgnitionControl,etc.Communications•MobilePhones,Pagers,Headsets,LANCards,etc.Electron

icsIndustrySectors电子工业部门计算机和商务设备计算器，电脑，复印机，服务器，等工业和医疗系统控制器。机器人，注入，听力，辅助，等消费电子盒式磁带录像机摄像机音箱耳机游戏，等汽车娱乐安全气囊防抱死制动系统点火控制，等通信电子手机传呼机耳机网卡电子工业7WhatisSur

faceMountTechnology(SMT)?什么是表面贴装技术（SMT）？•Amodernformofcomponentandassemblyprocesstechnology一种现代的元件和组装工艺技术•Usedbyelectronicsindu

strytomanufacturePrintedCircuitBoard(PCB)assemblies用于电子工业的印刷电路板（PCB）组装ElectronicsIndustryandSMT电子工业和自动粘贴技术8AlsoreferredtoasI

nsertionMountTechnology也被称为插入安装技术ElectroniccomponentsareInsertedintoholesinthePCB电子元件插入到PCB的孔里TechnologywhichisaCombinationofSurfaceMountandThroughH

oleTechnology这是一种表面贴装和通孔技术的组合ElectroniccomponentsAredirectlyplacedandAttachedtothesurfaceofthePCB.电子元件，直接安置和粘贴到PCB表面PCBAssemblyTypesP

CB组装方式9•Unavailabilityofoddshaped,highpower,andspecializedcomponents.奇怪形状，高功率，和一些特殊的元件不能用单一的组装技术。•Moreinvestmentrequiredtosetupaful

lSMTprocess建立一个全套的SMT制程需要更多的投资。•Inmanycasesitischeapertousethroughholecomponents插件元件在许多情况下是便宜的•THTismorer

obustandisnecessaryincertainapplications插件在某些应用中更可靠和必要WhymixedtechnologyPCBassembly?为什么有混合PCB组装技术1SMTandMixedTechnologyAssem

blyTypesSMT和混合组装技术类型1ElectricalConsiderations电器考量•PCBassemblydensityPCB组装密度•Powerrequirements电源需求•Powerandsignaldistribution电源和信号分布

•Input/Outputrequirements输入输出需要•Noise&Crosstalkbetweentraces,pads,layers,etc.PCB线路之间，焊盘之间,层与层之间的杂讯和共鸣•Hazardousvoltageisolation危

险电压的隔绝•Componentselection元件的选择ManufacturingConsiderations生产的考量•Assemblytypeandcomponentmix装配型号和元件的混合•Manufacturingprocesscapab

ility生产制程能力•Boardmaterial板材料•Inter-packageSpacing元件脚间距•Landpatterndesignandfootprintorientation焊环图案设计和器件封装方向•Productvolume产品量GeneralConsiderationsfor

PCBassemblyPCB组装的一般考量1ThermalConsiderations热考量•Inter-packagespacing元件脚间距•Thermalexpansionmismatch热膨胀系数不匹配•Glasstrans

itiontemperature玻璃化温度•Processingtemperatures加工温度•Operatingconditions工作条件•Thermalmanagementrequirements热管理要求Costc

onsiderations成本考量•PCBcostPCB成本•MaterialofthePCB物料成本•NumberoflayersPCBＰＣＢ层数•Tracewidthandspace线路宽度和空间•Viarequirements

过孔要求•Specialfinishrequirements特殊表面处理要求•Componentcost元件成本•Assemblyequipmentcost组装成本•Processingcost工艺成本GeneralConsiderat

ionsforPCBAssemblyPCB组装一般考量1MaterialConsiderations物料考量•Materialproperties材料特性•Compatibility兼容性•Applicationrequirements运用需求•Processingreq

uirements工艺需求•Cost成本•Thermal,electricalandmechanicalperformance/properties热，电气和机械性能/特性OtherConsiderations其他考量•Designfor…设计考量。Manufacture&Assembly

制造和组装Test测试Inspection检查Cost成本Procurement采购Service服务Environment环境•Protectionfromenvironmentaldamagecorrosionofcontacts从预防环

境损害和接触腐蚀•Connectionfailuresduetoshock,vibrationandflexingofPCBs由于冲击，振动和弯曲的PCB造成的连接失败。•Reliabilityofassembly组装的可靠性•Frictionalw

earofconnectors连接器的摩擦磨损•Procurementandleadtime采购和准备时间GeneralConsiderationsforPCBassemblyPCB组装的一般考量1WhySurfaceMountTechnolog

y?为什么有表面粘贴技术•Enablessignificantsizeandweightreduction可显着减少尺寸和重量•Providesimprovementinelectricalperforman

ce改善电气性能•OffersreasonablesolutionforhighpincountICs提供高引脚数集成电路合理的解决方案•Manufacturingassemblyismoreeasilyautomated生产装配更容易自动化•Offersthepotentialfors

ignificantcostreductions提供了降低成本的巨大潜力SurfaceMountTechnology(SMT)表面粘贴技术(SMT)1SurfaceMountTechnologyPerformance–表面粘贴技术性能

•Primemotivationisincreaseddensityandboardareareduction。主要目的是提高板密度和减少面积❑Smallerdevices(activesandpassives)小体积的主动元件和被动元件❑DIPsover40pinswereimprac

tical超过40支脚的插件元件是不切实际的❑Two-sidedmounting两面粘贴•SMTresultsinabetterproductSMT可以生产出一个更好的产品❑Samefunctionsforlessspace小的空间可以得到同样的功能❑Morefunctions

forsamespace同样的空间，跟多的功能❑Lesselectricalsignaldelays信号延迟少❑Lessmass,bettervibrationresistance更好的抗震性•InmanycasesSMTwasrequ

iredtomaketheproductfeasible很多案例中,SMT让产品成为可行SurfaceMountTechnology(SMT)表面粘贴技术(SMT)1•SMT-Amodernformofcomponent&assemblyprocesstechnology,

tomanufacturePCBassembliesSMT，一个现代PCB和元件组装工艺技术•ElectroniccomponentsaredirectlyplacedandattachedtothesurfaceofthePCB电子元件，直接安置和附着于印刷电路板的表面SurfaceM

ountTechnology(SMT)表面粘贴技术(SMT)1•SMTComponentsSMT元件SurfaceMountTechnology(SMT)表面粘贴技术(SMT)1SurfaceMountTechnology(SMT)表面粘贴技术(SMT)•SMTComponentsSMT元件

1SurfaceMountTechnology(SMT)SMTAssemblyTypes表面贴装类型•SurfaceMountactivesorpassivesononeorbothsidesofthe主动性和被动元件贴装在

PCB的一面或双面•Applications运用❑Mostwidelyusedwherehighestdensityisdesired最广泛的使用于高密度板❑Typicallyrequires4layersminimum通常最少需要4层

板❑SpaceSavings:Savingsofupto60-70%areattainable空间节省：可以实现高达60-70％是的节余2HowarePCBsassembled?PCBA怎样组装？WaveSolder波峰焊HandPlacement手摆放Visual

Inspection目检ICT在线测试PCBPreparationPCB准备PCBA测试RawComponent原始零件FT功能测试OverviewofSMTProcessSMT制程概述SMTProc

essSMTSolderPrinting锡膏印刷Pick&Place选择和放置零件PostReflow回流焊2SolderPrinting锡膏印刷Whatissolderprinting?什么是锡膏印刷•Processoftransferrin

gsolderpasteontothepadsofaPCB,byforcingitthroughmatingaperturesonastencil,usingasqueegee。用刮刀使用压力，使锡膏通过匹配的模具上的小孔，转移到PCB的焊盘的过程.2Circuit

Board线路板•Usetoprovideinterconnecttracesbetweencomponents提供元件间的相互连接Stencil钢板•Vehiclebywhichthevolumeandplacementlocationofsolderpast

edepositioniscontrolled控制锡膏流量和放置位置的媒介SolderPaste锡膏•Mixtureofsolderspheresandfluxdepositedontopadsofcircuitboardonacontrolledvolum

e.Afterreflowprovideselectrical,mechanicalandthermaldissipativeconnectionbetweencomponentandboard焊料和助焊剂的混合，定量的转化到

线路板的焊盘上。经过回流，提供元件和线路板之间的电气，机械和热耗散连接SolderPrinting锡膏印刷2Squeegee刮刀•Criticaltoolusedto“push”pastethroughthedesignatedopening

s.Variationsinhardness,flatness,speed,angleandpressurecriticallyimpactqualityoftheprint用于通过指定的开孔推动锡膏的关键工具。硬度，平整度，速读，角度和压力关键变量影响印刷的质量。Printer印刷机•M

achinewhichdepositssolderpasteontopadsonthecircuitboard将锡膏放到线路板上的机器SolderPrinting锡膏印刷2Pick&PlaceProcess选择和放置零件2•Aflex

iblemachinethatplacesmanydifferenttypesofcomponentsonaPCB灵活的机器，可以在一块PCB上放置许多不同类型的元件•MostimportantpieceofequipmentintheSM

Tassemblyprocess在SMT组装制程中最重要的一种设备。•Veryexpensive很昂贵•Withouttheuseofappropriatefeedersandamachinevisionsystem,theplacementequipmentwillnotbeabletop

ick&placecomponents如果没有适当的进料器和机器视觉系统的使用，安置设备将无法取放组件。•Itincludesfeaturessuchas:它包括以下的功能：❑Reliableplacementaccuracy可靠的放置精度❑Vacuumpickupcap

ability真空提取能力❑Automaticcomponentrealignment元件自动对准❑Visionsystem视觉系统❑TransportationsystemforPCBsPCBs运输系统Pick&Pla

ceProcess选择和放置零件2•FactorsinfluencingtheuseofautomatedplacementequipmentinSMT在SMT中影响自动贴装设备的使用的因素Handlingofcom

ponents,especiallysmallchipsandultra-finepitchleadeddevices元件的手动搬运和操作，尤其是小芯片和超细间距引线的器件❑Throughputrequirements吞吐量需求❑ReliabilityandAccuracy可靠性和准确性

❑Quality质量❑Flexibility灵活性Pick&PlaceProcess选择和放置零件零件进料PCB搬运育龄舰对准板办对准放置头机械手机壳2Pick&PlaceProcess选择和放置零件NormalPickUp正常的

提取•Z-AxismovestillcomponentistouchedZ-轴移动直到接触到元件•ThenZ-Axismovesbackandcomponentispickedup，然后，Z-轴移回原来的地方，元件被提起来Touchl

essPickUp无接触的提取•Z-AxismovestoafixedheightabovethecomponentZ-轴移动到元件上方一个固定的高度•Componentissuckedoutofthepocket元件被吸出袋外2PostReflowProcess回流焊Whatispostr

eflowprocess?什么是回流焊？•Processofjoiningmetallicsurfacesthroughthemassheatingofsolderorsolderpaste是通过大量加热，使锡膏受热融化从而让表面贴装元器件和PCB焊盘通过焊锡膏合金可靠地结合在一起的制程

。•CreatesamechanicalandelectricalconnectionbetweenthecomponentsandPCB在PCB和元件之间创建一种机械和电器的连接Surfacemountcomponentsaresecuredonthesurfaceandare

dependentonsoldervolumeformechanicalstrength表面粘贴元件依靠一定量的锡膏由于机械强度被固定在表面•Solderalloymetalismeltedtoformtheconnection合金焊料融化后，形成连接•Liq

uidsolderattachestothebasemetalsbyformingintermetalliccompounds,throughtheprocessofwetting液态焊料由金属间化和物，通过润湿流程附着在金属表面。2PostReflowProcess回流焊Requ

irementforsoldering–回流焊的需求❑SourceofSolder–Alloy焊料-合金❑SourceofHeat热源❑Flux助焊剂❑CompatibleMetallization兼容金属❑CleanSurfaces表面清洁❑ControlledProcess被控制的流程3Pos

tReflowProcess回流焊•SurfaceMountandThroughHoleSolderJoints表面焊接和通孔焊接3PostReflowProcess回流焊•Inthesolderingprocess,threedifferentheatingmethodsareu

sed三种不同的加热模式用在焊接制程中。❑Conduction热传导❑Convention热对流❑InfraredRadiation(IR)红外辐射•Differentheattransfermethodsofferdifferentadvantagesanddisadv

antages不同的热传输模式有不同的优势和劣势3Conduction热传导❑Conductionoccurswhentwosolidmassesofdifferenttemperaturesareincontactwit

heachother热传导发生在不同温度下的两个固体相互的接触❑Providesuniformproductheatingasheatwillconductfromahotspottoacoldspotintheproduct供给均匀的热，由于热能将从

热的一端传到冷的一端。PostReflowProcess回流焊3Convection--热对流•Convectionheattransferoccurswhenafluid(suchasairornitrogen)

flowsovertheobjecttobeheated热对流发生在气体吹过目标物（如空气或氮气）。•Twotypes-NaturalConvectionandForcedConvection两种方式-自然对流和强制性对流❑Naturalconvectionoccurswhennof

lowisbeingforcedovertheobject自然对流发生于没有气体被强制流过目标物。❑Forcedconvectionrequiresanexternalforcethatpushesorpullstheflowovertheobject强制对流需要一种外部的压力推动或拉动气流流

过目标物。•Mostsolderingovenstodayuseforcedconvectionastheprimaryheattransfermethod今天大多数焊接烤箱使用强制对流作为换热模式预热的主要方法PostReflowProcess回流焊3InfraredRadiat

ion(IR)红外辐射❑Infraredradiation(IR)occurswhentwobodiesofdifferenttemperaturesareinsightofeachother红外辐射发生与当两种不同温度的物体在相互的视野内❑H

eatistransferredbytheelectromagneticwavesgeneratedbythehotbody热被产生于热物体的电磁波转换。❑Twoimportantphenomenonwi

thradiation:两种重要的辐射现象Absorbtivity:PercentageofinfraredabsorbedbythePCBandcomponents吸收：被PCB和元件吸收的百分比BlackBod

y:Abodythatabsorbsallradiationincidentuponitssurface黑体：吸收所有表面辐射的物体PostReflowProcess回流焊3PostReflowProcess回流焊❑SolderingSurfaceMountComponents表面

粘贴元件SolderingReflowVaporPhaseIRForcedConvectionWaveSoldering焊接回流焊波峰焊蒸气红外辐射强制对流3AllthesolderedconnectsArecreatedinasinglestep所有的焊接在一个步骤完成Thesolde

redconnectionsareCreatedoneafteranother焊接在一个步骤接着另一个步骤地完成•SolderingThroughHoleComponents插件元件PostReflowProcess回流焊Solderingthr

oughHoleComponentsSimultaneousSequential插件元件一次性的连续性的3SimultaneousDipsolderingWaveSolderingwithsolderresistPostRe

flowProcess回流焊•SimultaneousSoldering一次性的浸焊有防焊的波峰焊3SequentialIronSolderingMini-flowsolderingLightSolderingLaserSolder

ingFlameSolderingPostReflowProcess回流焊•SequentialSoldering连续性的焊接持续性焊接烙铁焊小热风焊光波焊接镭射焊接火焰焊接3PostReflowProcess回流焊•GrowthTrend增长趋势4W

aveSolder波峰焊Wave-soldermachinemodule波峰焊机器模组•Conveyor传送带•SprayFluxer助焊剂喷洒机•Preheat预热器•SolderPot&Nozzles焊接棒和焊嘴4WaveSolder波峰焊•WaveSo

lderMachineLayout波峰焊机器分布进入喷洒助焊剂一区二区三区微波风刀冷却区输出风刀加热区-典型的强制热度对流层流波/振荡波4WaveSolder波峰焊波峰后的PCBA焊波喷洒助焊剂预热波峰焊

冷却4AssemblyPreparationforWaveSoldering波峰焊的准备•Fullyautomatedormanualinspectionoftheassemblytoverify:全部制动或手动目检oPresenceorabsenceofva

riouscomponents元件的存在和缺件oComponenttypeandorientations元件型号和方向oDamagedboards撞板oBadcomponentclinchingonthebottomside底面的损件•Selectivesolder

maskingusingtemporaryliquidsoldermaskortape,topreventsolderfromattachingtospecificareasofthePCBassembly选择性焊锡屏蔽使用临时液态防焊或胶带

，以防止焊料附着在PCB组装的指定的领域。•Addingedgesupportsfortheboard,topreventwarpingofthinboards添加边缘支持，以防止薄板弯曲WaveSolder波峰焊4WaveSoldera

ndThroughHoleAssemblyProcess波峰焊和插件组装流程RawPCBDIPInsertionRadialInsertionOdd-FormInsertionApplyTemporarysoldermaskIsPCBofstandardthickness?WaveSo

ldering**InsertionofTemperatureSensitiveComponentsSelectiveSolderingofTemperatureSensitiveComponentsRemoveTemporarySolderMaskAddBoardStiffnessF

orthinboards增加板的刚度Yes(StandardThickness=62-mils)标准厚度空板插件径向插入多种方式插件运用临时防焊PCB是标准厚度吗？温度敏感元件的插入温度敏感元件的可选择性焊接去除临时防焊物Inspection/Cleaning

目检和清洁…….No不是4WaveSolderandThroughHoleAssemblyProcess波峰焊和插件流程4Thanks!