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伟创力校企合作项目培训课程名称：PCBA制程工程技术概论与基础(PE+EE)编写部门：测试工程Name:KhooTeeWanDate:10Jan20102Contents内容PageObjectives目的Page-3Canyouimagineworldwithoutelectronics你能想象

世界没有电子的情景吗？Page-4ElectronicsIndustrySectors电子工业部门Page-5ElectronicsIndustryandSMT电子工业和自动粘贴技术Page-6PCBPack

agingTypePCB封装方式Page-7WhymixedtechnologyPCBpackaging?为什么有混合的封装方式Page-8SMTandMixedTechnologyAssemblyTypesＳＭＴ和多样的组装技术Page-9General

ConsiderationsforPCBPackagingＰＣＢ封装考量通择Page-10SurfaceMountTechnology表面粘贴技术Page-13OverviewofSMTProcessSMT制程概述Page-19SolderPrinting锡膏印刷Page-21Pi

ck&PlaceProcess选择和放置零件Page-23Contents3Contents内容PagePostReflowProcess回流焊Page-28WaveSolder波峰焊Page-40Wav

eSolderandThroughHoleAssemblyProcess波峰焊和插件组装制程Page-44Contents4Bytheendofthismodule,youwillbeableto:•Describeelectronicspackagingandsurfacemount

technology(SMT)•Comparedifferentassemblytypes•IdentifythedifferentassemblyprocessesformakingthePrintedCircuitBoard

(PCB)assembly•IdentifySMTcomponentsObjectives目的到本单元结束时，您将能够：•描述电子产品包装和表面贴装技术（SMT）•比较不同的装配类型•识别不同的装配工艺制造的印制•电路板(PCB）组装SMT元件

识别5CanyouimagineaworldwithoutElectronics?你能想象世界没有电子的情景吗？6ElectronicsIndustryComputer&BusinessEquipment•Calculator,PCs,Notebooks,Copiers,Servers,etc

.Industrial&MedicalSystems•Controls,Robots,Implants,HearingAids,etc.ConsumerElectronics•VCRs,Camcorders,Audio,Headsets,Games,et

c.Automotive•Entertainment,Airbags,ABS,IgnitionControl,etc.Communications•MobilePhones,Pagers,Headsets,LANCards,etc.ElectronicsIndustrySec

tors电子工业部门计算机和商务设备计算器，电脑，复印机，服务器，等工业和医疗系统控制器。机器人，注入，听力，辅助，等消费电子盒式磁带录像机摄像机音箱耳机游戏，等汽车娱乐安全气囊防抱死制动系统点火控制，等通信电子手机传呼机耳机网卡电子工业

7WhatisSurfaceMountTechnology(SMT)?什么是表面贴装技术（SMT）？•Amodernformofcomponentandassemblyprocesstechnology一种现代的元件和组装工艺技术•Usedbyelectronicsi

ndustrytomanufacturePrintedCircuitBoard(PCB)assemblies用于电子工业的印刷电路板（PCB）组装ElectronicsIndustryandSMT电子工业和自动粘贴技术8Alsore

ferredtoasInsertionMountTechnology也被称为插入安装技术ElectroniccomponentsareInsertedintoholesinthePCB电子元件插入到PCB的孔里Technologywhichi

saCombinationofSurfaceMountandThroughHoleTechnology这是一种表面贴装和通孔技术的组合ElectroniccomponentsAredirectlyplacedandAttachedtothesurfaceofthePCB.

电子元件，直接安置和粘贴到PCB表面PCBAssemblyTypesPCB组装方式9•Unavailabilityofoddshaped,highpower,andspecializedcomponents.

奇怪形状，高功率，和一些特殊的元件不能用单一的组装技术。•MoreinvestmentrequiredtosetupafullSMTprocess建立一个全套的SMT制程需要更多的投资。•Inmanycasesitischeap

ertousethroughholecomponents插件元件在许多情况下是便宜的•THTismorerobustandisnecessaryincertainapplications插件在某些应用中更可靠和必要Whymixedtechnol

ogyPCBassembly?为什么有混合PCB组装技术1SMTandMixedTechnologyAssemblyTypesSMT和混合组装技术类型1ElectricalConsiderations电器考量•P

CBassemblydensityPCB组装密度•Powerrequirements电源需求•Powerandsignaldistribution电源和信号分布•Input/Outputrequirements输入输出需要•Noise&Crosstalkbe

tweentraces,pads,layers,etc.PCB线路之间，焊盘之间,层与层之间的杂讯和共鸣•Hazardousvoltageisolation危险电压的隔绝•Componentselection元件的选择ManufacturingConsiderations生产的考

量•Assemblytypeandcomponentmix装配型号和元件的混合•Manufacturingprocesscapability生产制程能力•Boardmaterial板材料•Inter-packageSpacing元件脚间距•Landpatterndesignandf

ootprintorientation焊环图案设计和器件封装方向•Productvolume产品量GeneralConsiderationsforPCBassemblyPCB组装的一般考量1ThermalConsiderations热考量•Inter-packagespaci

ng元件脚间距•Thermalexpansionmismatch热膨胀系数不匹配•Glasstransitiontemperature玻璃化温度•Processingtemperatures加工温度•Operatingconditions工作条件•Thermalmanagem

entrequirements热管理要求Costconsiderations成本考量•PCBcostPCB成本•MaterialofthePCB物料成本•NumberoflayersPCBＰＣＢ层数•Tracewidthandspace线路

宽度和空间•Viarequirements过孔要求•Specialfinishrequirements特殊表面处理要求•Componentcost元件成本•Assemblyequipmentcost组装成本•Processingcos

t工艺成本GeneralConsiderationsforPCBAssemblyPCB组装一般考量1MaterialConsiderations物料考量•Materialproperties材料特性•Compatibilit

y兼容性•Applicationrequirements运用需求•Processingrequirements工艺需求•Cost成本•Thermal,electricalandmechanicalperfor

mance/properties热，电气和机械性能/特性OtherConsiderations其他考量•Designfor…设计考量。Manufacture&Assembly制造和组装Test测试Inspection检查C

ost成本Procurement采购Service服务Environment环境•Protectionfromenvironmentaldamagecorrosionofcontacts从预防环境损害和接触腐蚀•Connect

ionfailuresduetoshock,vibrationandflexingofPCBs由于冲击，振动和弯曲的PCB造成的连接失败。•Reliabilityofassembly组装的可靠性•Frictionalw

earofconnectors连接器的摩擦磨损•Procurementandleadtime采购和准备时间GeneralConsiderationsforPCBassemblyPCB组装的一般考量1WhySurfaceMountTech

nology?为什么有表面粘贴技术•Enablessignificantsizeandweightreduction可显着减少尺寸和重量•Providesimprovementinelectricalperformance改善电气性能•Offersreasonableso

lutionforhighpincountICs提供高引脚数集成电路合理的解决方案•Manufacturingassemblyismoreeasilyautomated生产装配更容易自动化•Offersthepotentialfors

ignificantcostreductions提供了降低成本的巨大潜力SurfaceMountTechnology(SMT)表面粘贴技术(SMT)1SurfaceMountTechnologyPerformance–表面粘

贴技术性能•Primemotivationisincreaseddensityandboardareareduction。主要目的是提高板密度和减少面积❑Smallerdevices(activesandpassives)小体

积的主动元件和被动元件❑DIPsover40pinswereimpractical超过40支脚的插件元件是不切实际的❑Two-sidedmounting两面粘贴•SMTresultsinabetterproductSMT可以生产出一个更好的产品❑Samefunctionsforlesss

pace小的空间可以得到同样的功能❑Morefunctionsforsamespace同样的空间，跟多的功能❑Lesselectricalsignaldelays信号延迟少❑Lessmass,bettervibrationresistance更好的抗震性•Inm

anycasesSMTwasrequiredtomaketheproductfeasible很多案例中,SMT让产品成为可行SurfaceMountTechnology(SMT)表面粘贴技术(SMT)1•SMT-Amodernformofcomponent&assemblypro

cesstechnology,tomanufacturePCBassembliesSMT，一个现代PCB和元件组装工艺技术•Electroniccomponentsaredirectlyplacedanda

ttachedtothesurfaceofthePCB电子元件，直接安置和附着于印刷电路板的表面SurfaceMountTechnology(SMT)表面粘贴技术(SMT)1•SMTComponentsSMT元件SurfaceMoun

tTechnology(SMT)表面粘贴技术(SMT)1SurfaceMountTechnology(SMT)表面粘贴技术(SMT)•SMTComponentsSMT元件1SurfaceMountTechnology(SMT)SMTAssemblyType

s表面贴装类型•SurfaceMountactivesorpassivesononeorbothsidesofthe主动性和被动元件贴装在PCB的一面或双面•Applications运用❑Mostwidelyusedwherehighestdensityisdesired最广泛的使

用于高密度板❑Typicallyrequires4layersminimum通常最少需要4层板❑SpaceSavings:Savingsofupto60-70%areattainable空间节省：可以

实现高达60-70％是的节余2HowarePCBsassembled?PCBA怎样组装？WaveSolder波峰焊HandPlacement手摆放VisualInspection目检ICT在线测试PCBPreparationPCB准备PCBA测试RawComponent原始零件FT功能测

试OverviewofSMTProcessSMT制程概述SMTProcessSMTSolderPrinting锡膏印刷Pick&Place选择和放置零件PostReflow回流焊2SolderPrinting锡膏印刷Whatissolderprinting?什么是锡膏印刷•

ProcessoftransferringsolderpasteontothepadsofaPCB,byforcingitthroughmatingaperturesonastencil,usingasqueegee。用刮刀使用压力，使锡膏通过匹配的模具上的小孔，转移到PCB的焊盘的过程.2C

ircuitBoard线路板•Usetoprovideinterconnecttracesbetweencomponents提供元件间的相互连接Stencil钢板•Vehiclebywhichthevolumeandplacementlocationo

fsolderpastedepositioniscontrolled控制锡膏流量和放置位置的媒介SolderPaste锡膏•Mixtureofsolderspheresandfluxdepositedontopadsofcircuitboardonacontrolledvolume.A

fterreflowprovideselectrical,mechanicalandthermaldissipativeconnectionbetweencomponentandboard焊料和助焊剂的混合，定量的转化到

线路板的焊盘上。经过回流，提供元件和线路板之间的电气，机械和热耗散连接SolderPrinting锡膏印刷2Squeegee刮刀•Criticaltoolusedto“push”pastethroughthedesi

gnatedopenings.Variationsinhardness,flatness,speed,angleandpressurecriticallyimpactqualityoftheprint用于通过指定的开孔推动锡膏的关键工具。硬度，平整度，速读，角

度和压力关键变量影响印刷的质量。Printer印刷机•Machinewhichdepositssolderpasteontopadsonthecircuitboard将锡膏放到线路板上的机器SolderPrinting锡膏印刷2Pick&PlaceP

rocess选择和放置零件2•AflexiblemachinethatplacesmanydifferenttypesofcomponentsonaPCB灵活的机器，可以在一块PCB上放置许多不同类型的元件•Mostimportantpieceo

fequipmentintheSMTassemblyprocess在SMT组装制程中最重要的一种设备。•Veryexpensive很昂贵•Withouttheuseofappropriatefeedersandamachine

visionsystem,theplacementequipmentwillnotbeabletopick&placecomponents如果没有适当的进料器和机器视觉系统的使用，安置设备将无法取放组件。•Itinc

ludesfeaturessuchas:它包括以下的功能：❑Reliableplacementaccuracy可靠的放置精度❑Vacuumpickupcapability真空提取能力❑Automaticcomponentrealignment元件自动对准❑Visionsystem视觉系统❑Tra

nsportationsystemforPCBsPCBs运输系统Pick&PlaceProcess选择和放置零件2•Factorsinfluencingtheuseofautomatedplacementequipment

inSMT在SMT中影响自动贴装设备的使用的因素Handlingofcomponents,especiallysmallchipsandultra-finepitchleadeddevices元件的手动搬运和操作，尤其是小芯片和超细间距引线的器件❑Throughputreq

uirements吞吐量需求❑ReliabilityandAccuracy可靠性和准确性❑Quality质量❑Flexibility灵活性Pick&PlaceProcess选择和放置零件零件进料PCB搬运育龄舰对准板办对

准放置头机械手机壳2Pick&PlaceProcess选择和放置零件NormalPickUp正常的提取•Z-AxismovestillcomponentistouchedZ-轴移动直到接触到元件•ThenZ-Axismovesbackandcomponentis

pickedup，然后，Z-轴移回原来的地方，元件被提起来TouchlessPickUp无接触的提取•Z-AxismovestoafixedheightabovethecomponentZ-轴移动到元件上方一个固定的高度•Componentissuckedoutofthepoc

ket元件被吸出袋外2PostReflowProcess回流焊Whatispostreflowprocess?什么是回流焊？•Processofjoiningmetallicsurfacesthroughthemasshe

atingofsolderorsolderpaste是通过大量加热，使锡膏受热融化从而让表面贴装元器件和PCB焊盘通过焊锡膏合金可靠地结合在一起的制程。•CreatesamechanicalandelectricalconnectionbetweenthecomponentsandPCB在PCB

和元件之间创建一种机械和电器的连接Surfacemountcomponentsaresecuredonthesurfaceandaredependentonsoldervolumeformechanicalstrength表面粘贴元件依靠一定量的锡膏由于

机械强度被固定在表面•Solderalloymetalismeltedtoformtheconnection合金焊料融化后，形成连接•Liquidsolderattachestothebasemetals

byformingintermetalliccompounds,throughtheprocessofwetting液态焊料由金属间化和物，通过润湿流程附着在金属表面。2PostReflowProcess回流焊Requirementforsoldering–回流焊的需求❑Sourc

eofSolder–Alloy焊料-合金❑SourceofHeat热源❑Flux助焊剂❑CompatibleMetallization兼容金属❑CleanSurfaces表面清洁❑ControlledProce

ss被控制的流程3PostReflowProcess回流焊•SurfaceMountandThroughHoleSolderJoints表面焊接和通孔焊接3PostReflowProcess回流焊•Inthesolderingprocess

,threedifferentheatingmethodsareused三种不同的加热模式用在焊接制程中。❑Conduction热传导❑Convention热对流❑InfraredRadiation(I

R)红外辐射•Differentheattransfermethodsofferdifferentadvantagesanddisadvantages不同的热传输模式有不同的优势和劣势3Conduction热

传导❑Conductionoccurswhentwosolidmassesofdifferenttemperaturesareincontactwitheachother热传导发生在不同温度下的两个固体相互的接触❑Providesuniformprod

uctheatingasheatwillconductfromahotspottoacoldspotintheproduct供给均匀的热，由于热能将从热的一端传到冷的一端。PostReflowProcess回流焊3Convection--热对流•Convectio

nheattransferoccurswhenafluid(suchasairornitrogen)flowsovertheobjecttobeheated热对流发生在气体吹过目标物（如空气或氮气）。•Twotypes-NaturalConv

ectionandForcedConvection两种方式-自然对流和强制性对流❑Naturalconvectionoccurswhennoflowisbeingforcedovertheobject自然对流发生于没有气

体被强制流过目标物。❑Forcedconvectionrequiresanexternalforcethatpushesorpullstheflowovertheobject强制对流需要一种外部的压力推

动或拉动气流流过目标物。•Mostsolderingovenstodayuseforcedconvectionastheprimaryheattransfermethod今天大多数焊接烤箱使用强制对流作为换热模式预热的主要方法PostReflowProcess回流焊3I

nfraredRadiation(IR)红外辐射❑Infraredradiation(IR)occurswhentwobodiesofdifferenttemperaturesareinsightofeachother红外辐射发生与当两种不同温度的物

体在相互的视野内❑Heatistransferredbytheelectromagneticwavesgeneratedbythehotbody热被产生于热物体的电磁波转换。❑Twoimportantphenomenonwithradiation:两种重要的辐射现象Absorbtivit

y:PercentageofinfraredabsorbedbythePCBandcomponents吸收：被PCB和元件吸收的百分比BlackBody:Abodythatabsorbsallradiationinc

identuponitssurface黑体：吸收所有表面辐射的物体PostReflowProcess回流焊3PostReflowProcess回流焊❑SolderingSurfaceMountComponents表面粘贴元件SolderingReflowVapo

rPhaseIRForcedConvectionWaveSoldering焊接回流焊波峰焊蒸气红外辐射强制对流3AllthesolderedconnectsArecreatedinasinglestep所有的焊接在一个步骤完成ThesolderedconnectionsareCrea

tedoneafteranother焊接在一个步骤接着另一个步骤地完成•SolderingThroughHoleComponents插件元件PostReflowProcess回流焊SolderingthroughHoleComponentsSimulta

neousSequential插件元件一次性的连续性的3SimultaneousDipsolderingWaveSolderingwithsolderresistPostReflowProcess回流焊•SimultaneousSoldering一次

性的浸焊有防焊的波峰焊3SequentialIronSolderingMini-flowsolderingLightSolderingLaserSolderingFlameSolderingPostReflowProcess回流焊•SequentialSoldering连续性的焊接

持续性焊接烙铁焊小热风焊光波焊接镭射焊接火焰焊接3PostReflowProcess回流焊•GrowthTrend增长趋势4WaveSolder波峰焊Wave-soldermachinemodule波峰焊机器模组•Conveyor传送

带•SprayFluxer助焊剂喷洒机•Preheat预热器•SolderPot&Nozzles焊接棒和焊嘴4WaveSolder波峰焊•WaveSolderMachineLayout波峰焊机器分布进入喷洒助焊剂一区二区三区微波风刀冷却区

输出风刀加热区-典型的强制热度对流层流波/振荡波4WaveSolder波峰焊波峰后的PCBA焊波喷洒助焊剂预热波峰焊冷却4AssemblyPreparationforWaveSoldering波峰焊的准备•Fullyautomatedorman

ualinspectionoftheassemblytoverify:全部制动或手动目检oPresenceorabsenceofvariouscomponents元件的存在和缺件oComponenttypeandorientations元件型号和方向oDamagedboards撞板

oBadcomponentclinchingonthebottomside底面的损件•Selectivesoldermaskingusingtemporaryliquidsoldermaskortape,topreventsolderfromattachingtospecificar

easofthePCBassembly选择性焊锡屏蔽使用临时液态防焊或胶带，以防止焊料附着在PCB组装的指定的领域。•Addingedgesupportsfortheboard,topreventwarpingofthinboards添加边缘支持，以防止薄板弯曲WaveSolder波峰焊4

WaveSolderandThroughHoleAssemblyProcess波峰焊和插件组装流程RawPCBDIPInsertionRadialInsertionOdd-FormInsertionApplyTemporarysoldermas

kIsPCBofstandardthickness?WaveSoldering**InsertionofTemperatureSensitiveComponentsSelectiveSolderingofTemperatureSe

nsitiveComponentsRemoveTemporarySolderMaskAddBoardStiffnessForthinboards增加板的刚度Yes(StandardThickness=62-mils)标准厚度空板插件径向插入多种方

式插件运用临时防焊PCB是标准厚度吗？温度敏感元件的插入温度敏感元件的可选择性焊接去除临时防焊物Inspection/Cleaning目检和清洁…….No不是4WaveSolderandThroughHoleAssemblyProcess波峰焊和插

件流程4Thanks!